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EE Times IBM: Copper Interconnects Here to Stay
Aluminum was previously fabricated as interconnects by depositing an even layer on a topping of dielectric with vias down to the silicon, after which it was etched. Since copper had to be encased in the tantalum compound, this substrative method was
Compound Semiconductor POET Posts Higher Revenue And Higher Losses
“We are making good progress and remain on track for a mid-2018 launch of our ROSA optical engine, which utilises our dielectric photonics platform. We have recently tested the bandwidth of our 25G PIN detector at a bandwidth that exceeds the 
Bulk Molding Compounds Market Poised to Garner Maximum ...
Carbon fiber bulk molding compoundsOn the basis of resin type, the bulk molding compounds market is segmented as follows:Polyester resin.
Phys.Org Simple green synthesis is a breath of fresh air - Phys.org
A method for creating nanoparticles without using solvents could lead to environmentally friendly electronics.

Thematic Books

Thin Film Processes II
Thin Film Processes II
Published by Academic Press 2012
ISBN 9780080524214,0080524214
888 pages
This sequel to the 1978 classic, Thin Film Processes, gives a clear, practical exposition of important thin film deposition and etching processes that have not yet been adequately reviewed. It discusses selected processes in tutorial overviews with implementation guide lines and an introduction to the literature. Though edited to stand alone, when taken together, Thin Film Processes II and its predecessor present a thorough grounding in modern thin film techniques. Key Features * Provides an...
Proteomics for Biological Discovery
Proteomics for Biological Discovery
Published by John Wiley & Sons 2006
ISBN 9780470007730,0470007737
320 pages
Popular Mechanics
Popular Mechanics
1989
Popular Mechanics inspires, instructs and influences readers to help them master the modern world. Whether it’s practical DIY home-improvement tips, gadgets and digital technology, information on the newest cars or the latest breakthroughs in science -- PM is the ultimate guide to our high-tech lifestyle.
Modern dielectric materials
Modern dielectric materials
1960
ISBN
253 pages
CRC Handbook of Metal Etchants
CRC Handbook of Metal Etchants
Published by CRC Press 1990
ISBN 1439822530,9781439822531
1415 pages
This publication presents cleaning and etching solutions, their applications, and results on inorganic materials. It is a comprehensive collection of etching and cleaning solutions in a single source. Chemical formulas are presented in one of three standard formats - general, electrolytic or ionized gas formats - to insure inclusion of all necessary operational data as shown in references that accompany each numbered formula. The book describes other applications of specific solutions,...

Bing news

Methodologies to Mitigate Chip-Package Interaction
The examples of the failure modes are inter-layer dielectric (ILD) cracking under bumps (Fig ... The CTE mismatch between dissimilar materials in a package, e.g. Si chip, molding compound (MC), die attach compound, and leadframe, results in ...
Dielectric materials evolve to meet the challenges of wafer-level packaging
Toshiaki Itabashi, DuPont Semiconductor Fabrication Materials, Kanagawa, Japan Polyimide dielectric materials have traditionally served as stress-buffer passivation layers (SBPs) on ICs that were wire-bonded to lead frames and encased in mold compound [1].
Predator’ becomes reality as scientists unveil a REAL camouflage cloak
‘The jungle… it just came alive and took him,’ says one of the terrified victims of the intergalactic hunter in Predator 1987. The Predator is able to slaugher its human victims – except Arnie – thanks to a hi-tech camouflage suit which lets it ...
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ags-dielectric-compound.jpg
dielectric grease "
dielectric grease "
dielectric grease 5 oz tube dielectric grease is in a 5 ounce tube ...
dielectric grease 5 oz tube dielectric grease is in a 5 ounce tube ...

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